1.Features:
- Lowest CostSn/Ag/CuAlloy - Excellent Fatigue Resistance - Compatible with all Flux Types
- Low Melting Point (217°C -218°C) - Excellent Solder Joint Reliability - Best Wetting Sn/Ag/Cu Alloy

2.Description:

AIM SAC305is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under
the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar
solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent
flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides
superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed
in the proprietary Electropure? method that results in a low drossing, high wetting solder. The
Electropure? process reduces suspended oxides in the solder, thus reducing drossing, improving flow and
reducing bridging during soldering. SAC305 may be used with most existing equipment, processes,
coatings, and flux chemistries.

3.Temperature Requirements:

Wave soldering pot temperature of 265° -270°C (510° -530°F).
Refer to the flux data sheet for specific pre-heat instructions.

4.Physical Properties:

Specific Gravity: Approx. 7.38
Melting Temperature: 217° -218°C (423° -424°F)